InfraDefenceThe capital behind defence.
Bank

J.P. Morgan

61 defence financings on file (49 as bookrunner, 8 as agent, 2 as bookrunner/arranger, 2 as lender), about US$105.6bn of deals led.

Borrowers and issuers: Lockheed Martin, Northrop Grumman, L3Harris Technologies, RTX (Raytheon Technologies), Textron, General Dynamics, Booz Allen Hamilton, Leidos.

Financings

DateFinancingTypeAmount
20 Aug 2026Thales €1bn bond to finance the Exail acquisitionBond€1bn
30 Jul 2026Booz Allen Hamilton US$1,200m senior notes (2 tranches)BondUS$1.2bn
20 Feb 2026Leidos US$1,400m senior notes (2 tranches)BondUS$1.4bn
29 Oct 2025Textron US$500m senior notes (1 tranche)BondUS$500m
24 Jul 2025Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
28 May 2025Northrop Grumman US$1,000m senior notes (2 tranches)BondUS$1bn
30 Apr 2025General Dynamics US$750m 4.950% notes due 2035BondUS$750m
13 Mar 2025Booz Allen Hamilton US$650m 5.950% senior notes due 2035BondUS$650m
18 Feb 2025Leidos US$1,000m senior notes (2 tranches)BondUS$1bn
5 Dec 2024Lockheed Martin US$1,000m senior notes (2 tranches)BondUS$1bn
14 Nov 2024Huntington Ingalls Industries US$1,000m senior notes (2 tranches)BondUS$1bn
27 Sep 2024Amentum US$1,000m 7.250% senior notes due 2032Acquisition financeUS$1bn
31 Jul 2024L3Harris Technologies US$6,684m senior notes (8 tranches)BondUS$6.68bn
13 Mar 2024L3Harris Technologies US$750m senior notes (1 tranche)BondUS$750m
31 Jan 2024Northrop Grumman US$2,500m senior notes (3 tranches)BondUS$2.5bn
26 Jan 2024Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
8 Nov 2023RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)BondUS$6bn
8 Nov 2023Textron US$350m senior notes (1 tranche)BondUS$350m
31 Oct 2023BGK US$1bn 6.25% notes due 2028 for the Armed Forces Support FundBondUS$1bn
3 Aug 2023Booz Allen Hamilton US$650m 5.950% senior notes due 2033BondUS$650m
31 Jul 2023L3Harris Technologies US$3,250m senior notes (3 tranches)BondUS$3.25bn
24 May 2023Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
17 Feb 2023Leidos US$750m 5.750% notes due 2033BondUS$750m
7 Feb 2023Northrop Grumman US$2,000m senior notes (2 tranches)BondUS$2bn
22 Nov 2022L3Harris US$2.25bn term loan for the Viasat tactical data links acquisitionAcquisition financeUS$2.25bn
20 Oct 2022Lockheed Martin US$4,000m senior notes (5 tranches)BondUS$4bn
24 Aug 2022Lockheed Martin US$3.0bn revolving credit facility (2022)Bank facilityUS$3bn
29 Jul 2022L3Harris US$2bn five-year revolving credit facility (2022)Bank facilityUS$2bn
22 Apr 2022Lockheed Martin US$2,300m senior notes (3 tranches)BondUS$2.3bn
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
24 Aug 2021Lockheed Martin US$3.0bn revolving credit facility (2021)Bank facilityUS$3bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
5 May 2021General Dynamics US$1,500m senior notes (3 tranches)BondUS$1.5bn
13 Nov 2020L3Harris Technologies US$650m 1.800% notes due 2031BondUS$650m
18 May 2020Lockheed Martin US$1,150m senior notes (2 tranches)BondUS$1.15bn
18 May 2020RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
25 Mar 2020General Dynamics US$4,000m senior notes (5 tranches)BondUS$4bn
23 Mar 2020Northrop Grumman US$2,250m senior notes (3 tranches)BondUS$2.25bn
11 Mar 2020Textron US$650m 3.0% notes due 2030BondUS$650m
13 Nov 2019L3Harris US$400m 2.900% notes due 2029BondUS$400m
30 Sep 2019Raytheon US$1.25bn revolving credit facilityBank facilityUS$1.25bn
28 Jun 2019L3Harris US$2bn five-year revolving credit facilityBank facilityUS$2bn
24 Aug 2018Lockheed Martin US$2.5bn revolving credit facility (2018)Bank facilityUS$2.5bn
17 Aug 2018Northrop Grumman US$2bn revolving credit facility (2018)Bank facilityUS$2bn
25 May 2018Harris Corporation US$850m 4.400% notes due 2028BondUS$850m
26 Feb 2018Harris Corporation US$300m floating rate notes due 2019BondUS$300m
12 Oct 2017Northrop Grumman US$8,250m senior notes (5 tranches)BondUS$8.25bn
12 Sep 2017General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
12 Sep 2017Textron US$300m 3.375% notes due 2028BondUS$300m
3 May 2017RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
30 Mar 2017Rockwell Collins US$4,650m senior notes (5 tranches)BondUS$4.65bn
30 Nov 2016Northrop Grumman US$750m 3.200% senior notes due 2027BondUS$750m
31 Oct 2016RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
30 Sep 2016Textron US$1.0bn revolving credit facility (2016)Bank facilityUS$1bn
11 Aug 2016General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
7 Mar 2016Textron US$350m 4.000% notes due 2026BondUS$350m
17 Nov 2015Lockheed Martin US$7,000m senior notes (6 tranches)BondUS$7bn
1 May 2015RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045BondUS$850m
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn
4 Feb 2015Northrop Grumman US$600m 3.850% senior notes due 2045BondUS$600m

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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