InfraDefenceThe capital behind defence.
Bond · 26 Jan 2024

Lockheed Martin US$2,000m senior notes (3 tranches)

Issuer or borrower
Lockheed Martin
Date
26 Jan 2024
Amount
US$2bn
Type
Bond
Structure
SEC-registered notes: US$650m 4.500% notes due 2029; US$600m 4.800% notes due 2034; US$750m 5.200% notes due 2064
Pricing
4.500% due 2029; 4.800% due 2034; 5.200% due 2064
Maturity
2029, 2034, 2064
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 26 Jan 2024

Checked against the documents above. Record DEF-2024-0001.

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