InfraDefenceThe capital behind defence.
Bond · 24 Jul 2025

Lockheed Martin US$2,000m senior notes (3 tranches)

Issuer or borrower
Lockheed Martin
Date
24 Jul 2025
Amount
US$2bn
Type
Bond
Structure
SEC-registered notes: US$500m 4.150% Notes due 2028; US$750m 4.400% Notes due 2030; US$750m 5.000% Notes due 2035
Maturity
2028-2035
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 24 Jul 2025

Checked against the documents above. Record DEF-2025-0014.

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