InfraDefenceThe capital behind defence.
Bond · 24 May 2023

Lockheed Martin US$2,000m senior notes (3 tranches)

Issuer or borrower
Lockheed Martin
Date
24 May 2023
Amount
US$2bn
Type
Bond
Structure
SEC-registered notes: US$500m 4.450% notes due 2028; US$850m 4.750% notes due 2034; US$650m 5.200% notes due 2055
Pricing
4.450% due 2028; 4.750% due 2034; 5.200% due 2055
Maturity
2028, 2034, 2055
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 24 May 2023

Checked against the documents above. Record DEF-2023-0005.

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