InfraDefenceThe capital behind defence.
Bond · 20 Oct 2022

Lockheed Martin US$4,000m senior notes (5 tranches)

Issuer or borrower
Lockheed Martin
Date
20 Oct 2022
Amount
US$4bn
Type
Bond
Structure
SEC-registered notes: US$500m 4.95% notes due 2025; US$750m 5.10% notes due 2027; US$1,000m 5.25% notes due 2033; US$1,000m 5.70% notes due 2054; US$750m 5.90% notes due 2063
Pricing
4.95% due 2025; 5.10% due 2027; 5.25% due 2033; 5.70% due 2054; 5.90% due 2063
Maturity
2025, 2027, 2033, 2054, 2063
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 20 Oct 2022

Checked against the documents above. Record DEF-2022-0003.

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