InfraDefenceThe capital behind defence.
Bond · 18 May 2020

Lockheed Martin US$1,150m senior notes (2 tranches)

Issuer or borrower
Lockheed Martin
Date
18 May 2020
Amount
US$1.15bn
Type
Bond
Structure
SEC-registered notes: US$400m 1.850% notes due 2030; US$750m 2.800% notes due 2050
Pricing
1.850% due 2030; 2.800% due 2050
Maturity
2030, 2050
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B5) sec.gov · 18 May 2020

Checked against the documents above. Record DEF-2020-0007.

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