InfraDefenceThe capital behind defence.
Bond · 5 Dec 2024

Lockheed Martin US$1,000m senior notes (2 tranches)

Issuer or borrower
Lockheed Martin
Date
5 Dec 2024
Amount
US$1bn
Type
Bond
Structure
SEC-registered notes: US$600m 4.700% Notes due 2031; US$400m 5.200% Notes due 2055
Maturity
2031-2055
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 5 Dec 2024

Checked against the documents above. Record DEF-2024-0013.

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M&A and investment involving Lockheed Martin

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