InfraDefenceThe capital behind defence.
Bond · 22 Apr 2022

Lockheed Martin US$2,300m senior notes (3 tranches)

Issuer or borrower
Lockheed Martin
Date
22 Apr 2022
Amount
US$2.3bn
Type
Bond
Structure
SEC-registered notes: US$800m 3.900% notes due 2032; US$850m 4.150% notes due 2053; US$650m 4.300% notes due 2062
Pricing
3.900% due 2032; 4.150% due 2053; 4.300% due 2062
Maturity
2032, 2053, 2062
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B2) sec.gov · 22 Apr 2022

Checked against the documents above. Record DEF-2022-0001.

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