InfraDefenceThe capital behind defence.
Bond · 13 Mar 2024

L3Harris Technologies US$750m senior notes (1 tranche)

Issuer or borrower
L3Harris Technologies
Date
13 Mar 2024
Amount
US$750m
Type
Bond
Structure
SEC-registered notes: US$750m 5.050% Notes due 2029
Maturity
2029
Country
United States

Sources

  1. L3Harris Technologies final prospectus supplement (424B5) sec.gov · 13 Mar 2024

Checked against the documents above. Record DEF-2024-0004.

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Randeep Bubbra
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