L3Harris Technologies US$3,250m senior notes (3 tranches)
- Issuer or borrower
- L3Harris Technologies
- Date
- 31 Jul 2023
- Amount
- US$3.25bn
- Type
- Bond
- Structure
- SEC-registered notes: US$1,250m 5.400% Notes due 2027; US$1,500m 5.400% Notes due 2033; US$500m 5.600% Notes due 2053
- Maturity
- 2027-2053
- Country
- United States
Sources
- L3Harris Technologies final prospectus supplement (424B5) sec.gov · 31 Jul 2023
Checked against the documents above. Record DEF-2023-0008.
Other financings by L3Harris Technologies
| Date | Financing | Type | Amount |
|---|---|---|---|
| 31 Jul 2024 | L3Harris Technologies US$6,684m senior notes (8 tranches) | Bond | US$6.68bn |
| 13 Mar 2024 | L3Harris Technologies US$750m senior notes (1 tranche) | Bond | US$750m |
| 13 Nov 2019 | L3Harris US$400m 2.900% notes due 2029 | Bond | US$400m |
| 28 Jun 2019 | L3Harris US$2bn five-year revolving credit facility | Bank facility | US$2bn |
| 24 Apr 2015 | L3Harris Technologies US$2,400m senior notes (5 tranches) | Bond | US$2.4bn |
M&A and investment involving L3Harris Technologies
| Date | Deal | Type | Value |
|---|---|---|---|
| 28 Jul 2023 | L3Harris acquisition of Aerojet Rocketdyne | M&A | US$4.7bn |
| 3 Jan 2023 | L3Harris acquisition of Viasat's Tactical Data Links business | M&A | US$1.96bn |
| 4 May 2020 | Leidos acquisition of L3Harris security detection businesses | M&A | US$1bn |
