L3Harris US$2bn five-year revolving credit facility
- Issuer or borrower
- L3Harris Technologies
- Date
- 28 Jun 2019
- Amount
- US$2bn
- Type
- Bank facility
- Structure
- Five-year senior unsecured revolving credit facility signed at completion of the Harris and L3 merger; JPMorgan Chase Bank administrative agent
- Maturity
- 2024
- Purpose
- Replaces Harris's prior US$1bn revolving credit facility
- Lenders and arrangers
- JPMorgan Chase, Citibank, Bank of America, Morgan Stanley MUFG Loan Partners and Wells Fargo (joint lead arrangers)
- Country
- United States
Sources
- L3Harris Technologies Form 8-K: completion of merger and new credit facility sec.gov · 1 Jul 2019
Checked against the documents above. Record DEF-2019-0005.
Other financings by L3Harris Technologies
| Date | Financing | Type | Amount |
|---|---|---|---|
| 31 Jul 2024 | L3Harris Technologies US$6,684m senior notes (8 tranches) | Bond | US$6.68bn |
| 13 Mar 2024 | L3Harris Technologies US$750m senior notes (1 tranche) | Bond | US$750m |
| 31 Jul 2023 | L3Harris Technologies US$3,250m senior notes (3 tranches) | Bond | US$3.25bn |
| 13 Nov 2019 | L3Harris US$400m 2.900% notes due 2029 | Bond | US$400m |
| 24 Apr 2015 | L3Harris Technologies US$2,400m senior notes (5 tranches) | Bond | US$2.4bn |
M&A and investment involving L3Harris Technologies
| Date | Deal | Type | Value |
|---|---|---|---|
| 28 Jul 2023 | L3Harris acquisition of Aerojet Rocketdyne | M&A | US$4.7bn |
| 3 Jan 2023 | L3Harris acquisition of Viasat's Tactical Data Links business | M&A | US$1.96bn |
| 4 May 2020 | Leidos acquisition of L3Harris security detection businesses | M&A | US$1bn |
