InfraDefenceThe capital behind defence.
Bond · 24 Apr 2015

L3Harris Technologies US$2,400m senior notes (5 tranches)

Issuer or borrower
L3Harris Technologies
Date
24 Apr 2015
Amount
US$2.4bn
Type
Bond
Structure
SEC-registered notes: US$500m 1.999% notes due 2018; US$400m 2.700% notes due 2020; US$600m 3.832% notes due 2025; US$400m 4.854% notes due 2035; US$500m 5.054% notes due 2045
Pricing
1.999% due 2018; 2.700% due 2020; 3.832% due 2025; 4.854% due 2035; 5.054% due 2045
Maturity
2018, 2020, 2025, 2035, 2045
Country
United States

Sources

  1. L3Harris Technologies final prospectus supplement (424B5) sec.gov · 24 Apr 2015

Checked against the documents above. Record DEF-2015-0003.

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