InfraDefenceThe capital behind defence.
Bond · 31 Jul 2024

L3Harris Technologies US$6,684m senior notes (8 tranches)

Issuer or borrower
L3Harris Technologies
Date
31 Jul 2024
Amount
US$6.68bn
Type
Bond
Structure
SEC-registered notes: US$600m 5.500% Notes due 2054; US$592m 5.500% Notes due 2054; US$748m 5.050% Notes due 2029; US$749m 5.250% Notes due 2031; US$749m 5.350% Notes due 2034; US$1,248m 5.400% Notes due 2027; US$1,498m 5.400% Notes due 2033; US$498m 5.600% Notes due 2053
Maturity
2027-2054
Country
United States

Sources

  1. L3Harris Technologies final prospectus supplement (424B5) sec.gov · 31 Jul 2024

Checked against the documents above. Record DEF-2024-0009.

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