InfraDefenceThe capital behind defence.
Bond · 17 Nov 2015

Lockheed Martin US$7,000m senior notes (6 tranches)

Issuer or borrower
Lockheed Martin
Date
17 Nov 2015
Amount
US$7bn
Type
Bond
Structure
SEC-registered notes: US$750m 1.85% notes due 2018; US$1,250m 2.50% notes due 2020; US$500m 3.10% notes due 2023; US$2,000m 3.55% notes due 2026; US$500m 4.50% notes due 2036; US$2,000m 4.70% notes due 2046
Pricing
1.85% due 2018; 2.50% due 2020; 3.10% due 2023; 3.55% due 2026; 4.50% due 2036; 4.70% due 2046
Maturity
2018, 2020, 2023, 2026, 2036, 2046
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B5) sec.gov · 17 Nov 2015

Checked against the documents above. Record DEF-2015-0006.

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