InfraDefenceThe capital behind defence.
Bond · 13 Feb 2015

Lockheed Martin US$2,250m senior notes (3 tranches)

Issuer or borrower
Lockheed Martin
Date
13 Feb 2015
Amount
US$2.25bn
Type
Bond
Structure
SEC-registered notes: US$750m 2.90% notes due 2025; US$500m 3.60% notes due 2035; US$1,000m 3.80% notes due 2045
Pricing
2.90% due 2025; 3.60% due 2035; 3.80% due 2045
Maturity
2025, 2035, 2045
Country
United States

Sources

  1. Lockheed Martin final prospectus supplement (424B5) sec.gov · 13 Feb 2015

Checked against the documents above. Record DEF-2015-0002.

Other financings by Lockheed Martin

M&A and investment involving Lockheed Martin

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

Newsletters

Weekly, one email. Work email only. Unsubscribe any time. Privacy.