Leidos US$1,400m senior notes (2 tranches)
- Issuer or borrower
- Leidos
- Date
- 20 Feb 2026
- Amount
- US$1.4bn
- Type
- Bond
- Structure
- SEC-registered notes: US$600m 4.100% notes due 2029; US$800m 5.000% notes due 2036
- Pricing
- 4.100% due 2029; 5.000% due 2036
- Maturity
- 2029, 2036
- Country
- United States
Sources
- Leidos final prospectus supplement (424B2) sec.gov · 20 Feb 2026
Checked against the documents above. Record DEF-2026-0003.
Other financings by Leidos
| Date | Financing | Type | Amount |
|---|---|---|---|
| 18 Feb 2025 | Leidos US$1,000m senior notes (2 tranches) | Bond | US$1bn |
| 17 Feb 2023 | Leidos US$750m 5.750% notes due 2033 | Bond | US$750m |
| 9 Oct 2020 | Leidos US$1,000m 2.300% notes due 2031 | Bond | US$1bn |
| 12 May 2020 | Leidos US$1,750m senior notes (3 tranches) | Bond | US$1.75bn |
M&A and investment involving Leidos
| Date | Deal | Type | Value |
|---|---|---|---|
| 4 May 2020 | Leidos acquisition of L3Harris security detection businesses | M&A | US$1bn |
| 31 Jan 2020 | Leidos acquisition of Dynetics | M&A | US$1.65bn |
| 16 Aug 2016 | Leidos combination with Lockheed Martin IS&GS | M&A | US$4.6bn |
