InfraDefenceThe capital behind defence.
Bond · 17 Feb 2023

Leidos US$750m 5.750% notes due 2033

Issuer or borrower
Leidos
Date
17 Feb 2023
Amount
US$750m
Type
Bond
Structure
SEC-registered notes: US$750m 5.750% notes due 2033
Pricing
5.750% due 2033
Maturity
2033
Country
United States

Sources

  1. Leidos final prospectus supplement (424B2) sec.gov · 17 Feb 2023

Checked against the documents above. Record DEF-2023-0003.

Other financings by Leidos

DateFinancingTypeAmount
20 Feb 2026Leidos US$1,400m senior notes (2 tranches)BondUS$1.4bn
18 Feb 2025Leidos US$1,000m senior notes (2 tranches)BondUS$1bn
9 Oct 2020Leidos US$1,000m 2.300% notes due 2031BondUS$1bn
12 May 2020Leidos US$1,750m senior notes (3 tranches)BondUS$1.75bn

M&A and investment involving Leidos

Randeep Bubbra
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