InfraDefenceThe capital behind defence.
Bank

SMBC Group

54 defence financings on file (30 as bookrunner, 19 as co-manager, 5 as lender), about US$52.0bn of deals led.

Borrowers and issuers: Textron, Lockheed Martin, RTX (Raytheon Technologies), Northrop Grumman, L3Harris Technologies, Leonardo, General Dynamics, Booz Allen Hamilton.

Financings

DateFinancingTypeAmount
30 Jul 2026Booz Allen Hamilton US$1,200m senior notes (2 tranches)BondUS$1.2bn
20 Feb 2026Leidos US$1,400m senior notes (2 tranches)BondUS$1.4bn
29 Oct 2025Textron US$500m senior notes (1 tranche)BondUS$500m
7 Oct 2025Leonardo €1.8bn ESG-linked revolving credit facility (2025)Bank facility€1.8bn
24 Jul 2025Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
28 May 2025Northrop Grumman US$1,000m senior notes (2 tranches)BondUS$1bn
30 Apr 2025General Dynamics US$750m 4.950% notes due 2035BondUS$750m
13 Mar 2025Booz Allen Hamilton US$650m 5.950% senior notes due 2035BondUS$650m
18 Feb 2025Leidos US$1,000m senior notes (2 tranches)BondUS$1bn
11 Feb 2025Textron US$500m senior notes (1 tranche)BondUS$500m
5 Dec 2024Lockheed Martin US$1,000m senior notes (2 tranches)BondUS$1bn
31 Jul 2024L3Harris Technologies US$6,684m senior notes (8 tranches)BondUS$6.68bn
13 Mar 2024L3Harris Technologies US$750m senior notes (1 tranche)BondUS$750m
31 Jan 2024Northrop Grumman US$2,500m senior notes (3 tranches)BondUS$2.5bn
26 Jan 2024Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
8 Nov 2023RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)BondUS$6bn
8 Nov 2023Textron US$350m senior notes (1 tranche)BondUS$350m
3 Aug 2023Booz Allen Hamilton US$650m 5.950% senior notes due 2033BondUS$650m
31 Jul 2023L3Harris Technologies US$3,250m senior notes (3 tranches)BondUS$3.25bn
24 May 2023Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
17 Feb 2023Leidos US$750m 5.750% notes due 2033BondUS$750m
7 Feb 2023Northrop Grumman US$2,000m senior notes (2 tranches)BondUS$2bn
20 Oct 2022Lockheed Martin US$4,000m senior notes (5 tranches)BondUS$4bn
22 Apr 2022Lockheed Martin US$2,300m senior notes (3 tranches)BondUS$2.3bn
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
7 Oct 2021Leonardo €2.4bn ESG-linked revolving credit facilityBank facility€2.4bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
5 May 2021General Dynamics US$1,500m senior notes (3 tranches)BondUS$1.5bn
13 Nov 2020L3Harris Technologies US$650m 1.800% notes due 2031BondUS$650m
4 Aug 2020Textron US$500m senior notes (1 tranche)BondUS$500m
18 May 2020Lockheed Martin US$1,150m senior notes (2 tranches)BondUS$1.15bn
18 May 2020RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
1 Apr 2020Textron US$500m 364-day term loan (2020)Bank facilityUS$500m
25 Mar 2020General Dynamics US$4,000m senior notes (5 tranches)BondUS$4bn
23 Mar 2020Northrop Grumman US$2,250m senior notes (3 tranches)BondUS$2.25bn
11 Mar 2020Textron US$650m 3.0% notes due 2030BondUS$650m
13 Nov 2019L3Harris US$400m 2.900% notes due 2029BondUS$400m
1 May 2019Textron US$300m 3.900% notes due 2029BondUS$300m
29 Nov 2018Leonardo €500m term loan (2018)Bank facility€500m
15 Aug 2018RTX (Raytheon Technologies) US$11,000m senior notes (7 tranches)BondUS$11bn
10 May 2018General Dynamics US$7,500m senior notes (7 tranches)BondUS$7.5bn
14 Feb 2018Leonardo €1.8bn revolving credit facility (2018)Bank facility€1.8bn
8 Nov 2017Textron US$350m floating rate notes due 2020BondUS$350m
12 Oct 2017Northrop Grumman US$8,250m senior notes (5 tranches)BondUS$8.25bn
12 Sep 2017Textron US$300m 3.375% notes due 2028BondUS$300m
3 May 2017RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
28 Feb 2017Textron US$350m 3.650% notes due 2027BondUS$350m
30 Nov 2016Northrop Grumman US$750m 3.200% senior notes due 2027BondUS$750m
31 Oct 2016RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
7 Mar 2016Textron US$350m 4.000% notes due 2026BondUS$350m
17 Nov 2015Lockheed Martin US$7,000m senior notes (6 tranches)BondUS$7bn
1 May 2015RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045BondUS$850m
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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