InfraDefenceThe capital behind defence.
Bank

Mizuho

39 defence financings on file (27 as bookrunner, 9 as co-manager, 2 as lender, 1 as agent), about US$86.3bn of deals led.

Borrowers and issuers: Lockheed Martin, RTX (Raytheon Technologies), Northrop Grumman, General Dynamics, L3Harris Technologies, Huntington Ingalls Industries, Rockwell Collins.

Financings

DateFinancingTypeAmount
24 Jul 2025Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
28 May 2025Northrop Grumman US$1,000m senior notes (2 tranches)BondUS$1bn
30 Apr 2025General Dynamics US$750m 4.950% notes due 2035BondUS$750m
5 Dec 2024Lockheed Martin US$1,000m senior notes (2 tranches)BondUS$1bn
14 Nov 2024Huntington Ingalls Industries US$1,000m senior notes (2 tranches)BondUS$1bn
31 Jul 2024L3Harris Technologies US$6,684m senior notes (8 tranches)BondUS$6.68bn
13 Mar 2024L3Harris Technologies US$750m senior notes (1 tranche)BondUS$750m
31 Jan 2024Northrop Grumman US$2,500m senior notes (3 tranches)BondUS$2.5bn
26 Jan 2024Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
8 Nov 2023RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)BondUS$6bn
31 Jul 2023L3Harris Technologies US$3,250m senior notes (3 tranches)BondUS$3.25bn
24 May 2023Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
7 Feb 2023Northrop Grumman US$2,000m senior notes (2 tranches)BondUS$2bn
20 Oct 2022Lockheed Martin US$4,000m senior notes (5 tranches)BondUS$4bn
24 Aug 2022Lockheed Martin US$3.0bn revolving credit facility (2022)Bank facilityUS$3bn
22 Apr 2022Lockheed Martin US$2,300m senior notes (3 tranches)BondUS$2.3bn
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
24 Aug 2021Lockheed Martin US$3.0bn revolving credit facility (2021)Bank facilityUS$3bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
5 May 2021General Dynamics US$1,500m senior notes (3 tranches)BondUS$1.5bn
18 May 2020Lockheed Martin US$1,150m senior notes (2 tranches)BondUS$1.15bn
18 May 2020RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
25 Mar 2020General Dynamics US$4,000m senior notes (5 tranches)BondUS$4bn
23 Mar 2020Northrop Grumman US$2,250m senior notes (3 tranches)BondUS$2.25bn
24 Aug 2018Lockheed Martin US$2.5bn revolving credit facility (2018)Bank facilityUS$2.5bn
15 Aug 2018RTX (Raytheon Technologies) US$11,000m senior notes (7 tranches)BondUS$11bn
10 May 2018General Dynamics US$7,500m senior notes (7 tranches)BondUS$7.5bn
12 Oct 2017Northrop Grumman US$8,250m senior notes (5 tranches)BondUS$8.25bn
12 Sep 2017General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
3 May 2017RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
30 Mar 2017Rockwell Collins US$4,650m senior notes (5 tranches)BondUS$4.65bn
30 Nov 2016Northrop Grumman US$750m 3.200% senior notes due 2027BondUS$750m
31 Oct 2016RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
11 Aug 2016General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
17 Nov 2015Lockheed Martin US$7,000m senior notes (6 tranches)BondUS$7bn
1 May 2015RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045BondUS$850m
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn
4 Feb 2015Northrop Grumman US$600m 3.850% senior notes due 2045BondUS$600m

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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