InfraDefenceThe capital behind defence.
Bank

Goldman Sachs

37 defence financings on file (34 as bookrunner, 3 as co-manager), about US$82.3bn of deals led.

Borrowers and issuers: Lockheed Martin, RTX (Raytheon Technologies), Northrop Grumman, Textron, Booz Allen Hamilton, Leidos.

Financings

DateFinancingTypeAmount
30 Jul 2026Booz Allen Hamilton US$1,200m senior notes (2 tranches)BondUS$1.2bn
20 Feb 2026Leidos US$1,400m senior notes (2 tranches)BondUS$1.4bn
29 Oct 2025Textron US$500m senior notes (1 tranche)BondUS$500m
24 Jul 2025Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
28 May 2025Northrop Grumman US$1,000m senior notes (2 tranches)BondUS$1bn
13 Mar 2025Booz Allen Hamilton US$650m 5.950% senior notes due 2035BondUS$650m
18 Feb 2025Leidos US$1,000m senior notes (2 tranches)BondUS$1bn
5 Dec 2024Lockheed Martin US$1,000m senior notes (2 tranches)BondUS$1bn
31 Jan 2024Northrop Grumman US$2,500m senior notes (3 tranches)BondUS$2.5bn
26 Jan 2024Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
8 Nov 2023RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)BondUS$6bn
8 Nov 2023Textron US$350m senior notes (1 tranche)BondUS$350m
3 Aug 2023Booz Allen Hamilton US$650m 5.950% senior notes due 2033BondUS$650m
24 May 2023Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
17 Feb 2023Leidos US$750m 5.750% notes due 2033BondUS$750m
7 Feb 2023Northrop Grumman US$2,000m senior notes (2 tranches)BondUS$2bn
20 Oct 2022Lockheed Martin US$4,000m senior notes (5 tranches)BondUS$4bn
22 Apr 2022Lockheed Martin US$2,300m senior notes (3 tranches)BondUS$2.3bn
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
4 Aug 2020Textron US$500m senior notes (1 tranche)BondUS$500m
18 May 2020Lockheed Martin US$1,150m senior notes (2 tranches)BondUS$1.15bn
18 May 2020RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
23 Mar 2020Northrop Grumman US$2,250m senior notes (3 tranches)BondUS$2.25bn
1 May 2019Textron US$300m 3.900% notes due 2029BondUS$300m
15 Aug 2018RTX (Raytheon Technologies) US$11,000m senior notes (7 tranches)BondUS$11bn
12 Oct 2017Northrop Grumman US$8,250m senior notes (5 tranches)BondUS$8.25bn
3 May 2017RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
28 Feb 2017Textron US$350m 3.650% notes due 2027BondUS$350m
30 Nov 2016Northrop Grumman US$750m 3.200% senior notes due 2027BondUS$750m
31 Oct 2016RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
7 Mar 2016Textron US$350m 4.000% notes due 2026BondUS$350m
17 Nov 2015Lockheed Martin US$7,000m senior notes (6 tranches)BondUS$7bn
1 May 2015RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045BondUS$850m
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn
4 Feb 2015Northrop Grumman US$600m 3.850% senior notes due 2045BondUS$600m

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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