InfraDefenceThe capital behind defence.
Bank

Credit Agricole CIB

28 defence financings on file (10 as bookrunner, 7 as bookrunner/arranger, 5 as co-manager, 5 as lender, 1 as agent), about US$42.2bn of deals led.

Borrowers and issuers: Lockheed Martin, RTX (Raytheon Technologies), Thales, Leonardo, Rheinmetall, Rockwell Collins.

Financings

DateFinancingTypeAmount
20 Aug 2026Thales €1bn bond to finance the Exail acquisitionBond€1bn
28 May 2026Rheinmetall €500m senior bond due 2031Bond€500m
24 Jul 2025Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
5 Dec 2024Lockheed Martin US$1,000m senior notes (2 tranches)BondUS$1bn
26 Jan 2024Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
8 Nov 2023RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)BondUS$6bn
24 May 2023Lockheed Martin US$2,000m senior notes (3 tranches)BondUS$2bn
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
20 Oct 2022Lockheed Martin US$4,000m senior notes (5 tranches)BondUS$4bn
24 Aug 2022Lockheed Martin US$3.0bn revolving credit facility (2022)Bank facilityUS$3bn
22 Apr 2022Lockheed Martin US$2,300m senior notes (3 tranches)BondUS$2.3bn
20 Dec 2021Leonardo €600m ESG-linked term loanBank facility€600m
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
7 Oct 2021Leonardo €2.4bn ESG-linked revolving credit facilityBank facility€2.4bn
24 Sep 2021Rheinmetall €500m syndicated revolving credit facilityBank facility€500m
24 Aug 2021Lockheed Martin US$3.0bn revolving credit facility (2021)Bank facilityUS$3bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
19 Nov 2020Thales €500m 0% bond due 2026Bond€500m
1 Jul 2020Leonardo €500m 2.375% Eurobond due 2026Bond€500m
18 May 2020Lockheed Martin US$1,150m senior notes (2 tranches)BondUS$1.15bn
18 May 2020RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
7 May 2020Thales €700m 1% bond due 2028Bond€700m
24 Aug 2018Lockheed Martin US$2.5bn revolving credit facility (2018)Bank facilityUS$2.5bn
Jun 2017Leonardo €600m 1.50% Eurobond due 2024Bond€600m
30 Mar 2017Rockwell Collins US$4,650m senior notes (5 tranches)BondUS$4.65bn
31 May 2016Thales €600m 0.75% bond due 2023Bond€600m
17 Nov 2015Lockheed Martin US$7,000m senior notes (6 tranches)BondUS$7bn
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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