Bank

Siebert Williams Shank

20 defence financings on file (20 as co-manager).

Borrowers and issuers: Northrop Grumman, RTX (Raytheon Technologies), Lockheed Martin, Textron, L3Harris Technologies, General Dynamics, Booz Allen Hamilton.

Financings

Date	Financing	Type	Amount
28 May 2025	Northrop Grumman US$1,000m senior notes (2 tranches)	Bond	US$1bn
30 Apr 2025	General Dynamics US$750m 4.950% notes due 2035	Bond	US$750m
11 Feb 2025	Textron US$500m senior notes (1 tranche)	Bond	US$500m
31 Jul 2024	L3Harris Technologies US$6,684m senior notes (8 tranches)	Bond	US$6.68bn
31 Jan 2024	Northrop Grumman US$2,500m senior notes (3 tranches)	Bond	US$2.5bn
8 Nov 2023	RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)	Bond	US$6bn
8 Nov 2023	Textron US$350m senior notes (1 tranche)	Bond	US$350m
3 Aug 2023	Booz Allen Hamilton US$650m 5.950% senior notes due 2033	Bond	US$650m
24 May 2023	Lockheed Martin US$2,000m senior notes (3 tranches)	Bond	US$2bn
27 Feb 2023	RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)	Bond	US$3bn
7 Feb 2023	Northrop Grumman US$2,000m senior notes (2 tranches)	Bond	US$2bn
22 Apr 2022	Lockheed Martin US$2,300m senior notes (3 tranches)	Bond	US$2.3bn
3 Nov 2021	RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)	Bond	US$2.1bn
6 Aug 2021	RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)	Bond	US$2bn
13 Nov 2020	L3Harris Technologies US$650m 1.800% notes due 2031	Bond	US$650m
18 May 2020	Lockheed Martin US$1,150m senior notes (2 tranches)	Bond	US$1.15bn
23 Mar 2020	Northrop Grumman US$2,250m senior notes (3 tranches)	Bond	US$2.25bn
11 Mar 2020	Textron US$650m 3.0% notes due 2030	Bond	US$650m
13 Nov 2019	L3Harris US$400m 2.900% notes due 2029	Bond	US$400m
17 Nov 2015	Lockheed Martin US$7,000m senior notes (6 tranches)	Bond	US$7bn

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Siebert Williams Shank

Financings

The week in defence finance, read from the filings.