InfraDefenceThe capital behind defence.
Bank

MUFG

39 defence financings on file (18 as co-manager, 16 as bookrunner, 2 as lender, 2 as bookrunner/arranger, 1 as agent), about US$23.8bn of deals led.

Borrowers and issuers: Textron, RTX (Raytheon Technologies), General Dynamics, Leidos, Northrop Grumman, Thales, Booz Allen Hamilton, Leonardo.

Financings

DateFinancingTypeAmount
20 Feb 2026Leidos US$1,400m senior notes (2 tranches)BondUS$1.4bn
29 Oct 2025Textron US$500m senior notes (1 tranche)BondUS$500m
30 Apr 2025General Dynamics US$750m 4.950% notes due 2035BondUS$750m
18 Feb 2025Leidos US$1,000m senior notes (2 tranches)BondUS$1bn
11 Feb 2025Textron US$500m senior notes (1 tranche)BondUS$500m
8 Nov 2023Textron US$350m senior notes (1 tranche)BondUS$350m
3 Aug 2023Booz Allen Hamilton US$650m 5.950% senior notes due 2033BondUS$650m
27 Feb 2023RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)BondUS$3bn
17 Feb 2023Leidos US$750m 5.750% notes due 2033BondUS$750m
3 Nov 2021RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)BondUS$2.1bn
7 Oct 2021Leonardo €2.4bn ESG-linked revolving credit facilityBank facility€2.4bn
6 Aug 2021RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)BondUS$2bn
5 May 2021General Dynamics US$1,500m senior notes (3 tranches)BondUS$1.5bn
9 Oct 2020Leidos US$1,000m 2.300% notes due 2031BondUS$1bn
4 Aug 2020Textron US$500m senior notes (1 tranche)BondUS$500m
12 May 2020Leidos US$1,750m senior notes (3 tranches)BondUS$1.75bn
25 Mar 2020General Dynamics US$4,000m senior notes (5 tranches)BondUS$4bn
23 Mar 2020Northrop Grumman US$2,250m senior notes (3 tranches)BondUS$2.25bn
11 Mar 2020Textron US$650m 3.0% notes due 2030BondUS$650m
28 Jun 2019L3Harris US$2bn five-year revolving credit facilityBank facilityUS$2bn
1 May 2019Textron US$300m 3.900% notes due 2029BondUS$300m
15 Aug 2018RTX (Raytheon Technologies) US$11,000m senior notes (7 tranches)BondUS$11bn
10 May 2018General Dynamics US$7,500m senior notes (7 tranches)BondUS$7.5bn
16 Jan 2018Thales €500m 0.75% bond due 2025Bond€500m
12 Oct 2017Northrop Grumman US$8,250m senior notes (5 tranches)BondUS$8.25bn
12 Sep 2017General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
12 Sep 2017Textron US$300m 3.375% notes due 2028BondUS$300m
3 May 2017RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
30 Mar 2017Rockwell Collins US$4,650m senior notes (5 tranches)BondUS$4.65bn
28 Feb 2017Textron US$350m 3.650% notes due 2027BondUS$350m
30 Nov 2016Northrop Grumman US$750m 3.200% senior notes due 2027BondUS$750m
31 Oct 2016RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)BondUS$4bn
30 Sep 2016Textron US$1.0bn revolving credit facility (2016)Bank facilityUS$1bn
11 Aug 2016General Dynamics US$1,000m senior notes (2 tranches)BondUS$1bn
31 May 2016Thales €600m 0.75% bond due 2023Bond€600m
7 Mar 2016Textron US$350m 4.000% notes due 2026BondUS$350m
1 May 2015RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045BondUS$850m
13 Feb 2015Lockheed Martin US$2,250m senior notes (3 tranches)BondUS$2.25bn
4 Feb 2015Northrop Grumman US$600m 3.850% senior notes due 2045BondUS$600m

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.

Randeep Bubbra
InfraDefence Weekly

The week in defence finance, read from the filings.

Deals, terms and the clauses behind them, for the people financing primes, mid-tiers and new defence technology. By Randeep Bubbra.

Working on a financing like this? Book 20 minutes with Randeep to see how it compares.

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