Bank

Deutsche Bank

19 defence financings on file (11 as bookrunner, 4 as bookrunner/arranger, 3 as co-manager, 1 as lender), about US$38.6bn of deals led.

Borrowers and issuers: RTX (Raytheon Technologies), Thales, Northrop Grumman, L3Harris Technologies, Rheinmetall, Leonardo.

Financings

Date	Financing	Type	Amount
20 Aug 2026	Thales €1bn bond to finance the Exail acquisition	Bond	€1bn
28 May 2026	Rheinmetall €500m senior bond due 2031	Bond	€500m
8 Nov 2023	RTX (Raytheon Technologies) US$6,000m senior notes (5 tranches)	Bond	US$6bn
27 Feb 2023	RTX (Raytheon Technologies) US$3,000m senior notes (3 tranches)	Bond	US$3bn
3 Nov 2021	RTX (Raytheon Technologies) US$2,100m senior notes (2 tranches)	Bond	US$2.1bn
7 Oct 2021	Leonardo €2.4bn ESG-linked revolving credit facility	Bank facility	€2.4bn
6 Aug 2021	RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)	Bond	US$2bn
19 Nov 2020	Thales €500m 0% bond due 2026	Bond	€500m
13 Nov 2020	L3Harris Technologies US$650m 1.800% notes due 2031	Bond	US$650m
18 May 2020	RTX (Raytheon Technologies) US$2,000m senior notes (2 tranches)	Bond	US$2bn
7 May 2020	Thales €700m 1% bond due 2028	Bond	€700m
6 Mar 2020	L3Harris Technologies US$250m floating rate notes due 2023	Bond	US$250m
15 Aug 2018	RTX (Raytheon Technologies) US$11,000m senior notes (7 tranches)	Bond	US$11bn
12 Oct 2017	Northrop Grumman US$8,250m senior notes (5 tranches)	Bond	US$8.25bn
3 May 2017	RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)	Bond	US$4bn
30 Nov 2016	Northrop Grumman US$750m 3.200% senior notes due 2027	Bond	US$750m
31 Oct 2016	RTX (Raytheon Technologies) US$4,000m senior notes (5 tranches)	Bond	US$4bn
1 May 2015	RTX (Raytheon Technologies) US$850m 4.150% senior notes due 2045	Bond	US$850m
4 Feb 2015	Northrop Grumman US$600m 3.850% senior notes due 2045	Bond	US$600m

Roles come from the filings and announcements cited on each record. Volumes are full deal sizes, not this lender's share.