InfraDefenceThe capital behind defence.
Bond · 22 Apr 2020

ST Engineering US$750m 1.50% notes due 2025

Lengthen the group's debt tenor and optimise its short-term to long-term debt mix

Key terms

Borrower or issuer
ST Engineering
Date
22 Apr 2020
Type
Bond
Amount
US$750m
Pricing
1.50% coupon
Maturity
2025-04-29
Rating at issue
AAA (index)

Recorded terms

Structure
Five-year notes issued by ST Engineering RHQ Ltd. on 29 April 2020, the first issue under the new S$5bn programme
Country
Singapore

Rating at issue

Rated AAA at issue on the index basis (middle of three agencies, lower of two), from the issuer's own release.

The Notes to be issued have been rated "AAA" by Standard & Poor's Ratings Services
From the issuer's own release

Ratings change over time; check the agencies for the current rating.

Parties

Similar financings

More from ST Engineering

Sources

  1. ST Engineering: ST Engineering RHQ Ltd. to issue US$750,000,000 1.50% Notes due 2025 stengg.com · 22 Apr 2020

About this record

Record DEF-2020-0035, taken from an issuer, lender or government announcement. Confirmed against the primary documents listed. Amounts are as announced; US$ equivalents use approximate annual average exchange rates. Spotted an error or have a document we have missed? Send a correction, and changes are logged on Updates and corrections.

Read the structure

Senior notes are unsecured promises to pay, priced off government bonds; the prospectus sets the covenants, the change-of-control put and the redemption terms.

Randeep Bubbra
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