InfraDefenceThe capital behind defence.
Acquisition finance · 2 May 2016

Mercury Systems US$300m credit facility for the Microsemi carve-out

Fund the acquisition of Microsemi's embedded security, RF and microwave businesses

Key terms

Borrower or issuer
Mercury Systems
Date
2 May 2016
Type
Acquisition finance
Amount
US$300m
Maturity
2021

Recorded terms

Structure
US$200m term loan and US$100m revolving credit facility
Lenders and arrangers
Bank of America, N.A. (administrative agent)
Country
United States

Parties

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More from Mercury Systems

DateFinancingTypeAmount
28 Feb 2022Mercury Systems US$1.1bn revolving credit facility (upsized)Bank facilityUS$1.1bn
1 Oct 2018Mercury Systems US$750m revolving credit facility (upsized)Bank facilityUS$750m

M&A and investment involving Mercury Systems

DateDealTypeValue
30 Dec 2020Mercury Systems acquisition of Physical Optics CorporationM&AUS$310m
23 May 2019Mercury Systems US$414m share offeringEquity raiseUS$414m
1 Feb 2018Mercury Systems acquisition of Themis ComputerM&AUS$180m
27 Jan 2017Mercury Systems US$198m share offeringEquity raiseUS$198m
8 Apr 2016Mercury Systems US$87m share offeringEquity raiseUS$86.6m

Sources

  1. Mercury Systems Form 8-K sec.gov · 2 May 2016

About this record

Record DEF-2016-0002, taken from an issuer, lender or government announcement. Confirmed against the primary documents listed. Amounts are as announced; US$ equivalents use approximate annual average exchange rates. Spotted an error or have a document we have missed? Send a correction, and changes are logged on Updates and corrections.

Read the structure

Acquisition debt is committed before signing, often as a bridge, and refinanced with bonds or term loans once the deal closes.

Randeep Bubbra
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